Comparison ledger
Applied Materials 0010-13622 RF Match for, Applied Materials Endura 4.0, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | Endura 4.0Applied Materials |
|---|---|---|
| OEM | Applied Materials | Applied Materials |
| Category | Deposition | Deposition |
| Wafer size | — | 25-wafer FOUP Loadports (3) |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | Applied Materials Endura |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | PVD Endura Type Controller[2] |
| Model | 0010-13622[1] | Endura 4.0[2] |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| Factory Interface | — | 4.0[2] |
| Wafer size | — | 25-wafer FOUP Loadports (3)[2] |
| OEM | — | Applied Materials[2] |
| Process type | — | PVD (Physical Vapor Deposition)[2] |
| Category | — | Deposition[3] |
| Wafer handling | — | 25-wafer FOUP Loadports (3)[2] |
| Controller | — | PVD Endura Type Controller[2] |
| Remote generator rack | — | PVD Endura Type Remote Generator Rack[2] |
| Vacuum | — | Cryo Compressor[2] |
| Heat exchanger | — | Thermo Neslab Heat Exchanger[2] |
| Pump systems | — | Edwards iQDP80/IQMB250 pump systems for loadlock, system, and process chambers (may not be included)[2] |
| Compliance marking | — | CE Mark[2] |
| Storage | — | No HDD[2] |
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