Comparison ledger
Applied Materials 0010-13622 RF Match for, CHA SEC-600, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0010-13622 RF Match forApplied Materials | SEC-600CHA |
|---|---|---|
| OEM | Applied Materials | CHA |
| Category | Deposition | Deposition |
| Wafer size | — | 6 in. |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0010-13622 RF Match for | CHA SEC-600 |
| Specifications | ||
| Configuration | High Efficiency HE RF Match-Bias[1] | — |
| Model | 0010-13622[1] | — |
| Product Type | RF Match for PVD (Physical Vapor Deposition)[1] | — |
| Feature | High Efficiency HE RF Match-Bias[1] | — |
| System type | — | Sputtering System[2] |
| Wafer size | — | 6 in.[2] |
| Equipment description | — | E-beam evaporator[4] |
| Approved deposition materials | — | Al, Au, Ag, Cu, Cr, Ge, Ni, Mo, Pd, Pt, Ti, and others on a case-by-case basis[4] |
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