Waferpedia

Comparison ledger

0010-21246 PartversusAS 8

Applied Materials 0010-21246 Part, SUSS MicroTec AS 8, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0010-21246 PartApplied Materials
AS 8SUSS MicroTec
OEMApplied MaterialsSUSS MicroTec
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—SUSS MicroTec AS 8
Specifications
Substrate size (round)—up to 200 mm[1]
Substrate size (square)—up to 6" edge length[1]
Dual-nozzle substrate sizes—Ø150 mm, Ø200 mm[1]
Single-nozzle substrate sizes—Ø3", Ø100 mm, Ø150 mm, Ø200 mm[1]
Z-axis adjustment range—up to 45 mm[1]
Nozzle adjustment range—67.5 mm to 107.5 mm[1]
Spray axis maximum velocity—500 mm/s[1]
Spray axis acceleration—up to 9 m/s²[1]
Chuck maximum rotation speed—1,000 rpm[1]
Heated chuck—optional[1]
Splash-ring design—included[1]
Sources (1)Every fact above is drawn from these public sources
  1. [1]suss.comsuss.com