Waferpedia

Comparison ledger

0010-22161 High EFF RF MatchversusHorizon 8

Applied Materials 0010-22161 High EFF RF Match, DEK Horizon 8, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
OEMApplied MaterialsDEK
Category——
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0010-22161 High EFF RF MatchDEK Horizon 8
Specifications
MakeApplied Materials[1]—
Model0010-22161[1]Horizon 8[3]
DescriptionHTESC PH 1 REV A[2]—
ConditionUsed[2]—
Stock NumberBM6628[2]—
DOM—2013[3]
Max Board—508mm(X) ×508mm(Y) (20" x 20")[3]
Power Req—115V, 1PH[3]
Maximum printing surface—508 mm (X) × 508 mm (Y)[4]
Standard cycle time—10 seconds + process[4]
Weight—Approx. 690 kg[4]
Board size—508 mm (X) × 508 mm (Y) / 20 in × 20 in[3]
Process flow—Left to right[3]
Max stencil—29 in × 29 in[3]
Power requirement—115 V, 1 phase[3]
Sources (4)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]tarasemi.comtarasemi.com
  3. [3]dealer listingwotol.com
  4. [4]flason-smt.comflason-smt.com