Waferpedia

Comparison ledger

0020 17485 PartversusEX 550 C 12 Vapor

Applied Materials 0020 17485 Part, Ulvac EX 550 C 12 Vapor, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 17485 PartApplied Materials
OEMApplied MaterialsUlvac
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 17485 PartUlvac EX 550 C 12 Vapor
Specifications
ConfigurationStrap, RF Out 2 Balanced Coil Match, Hdp[1]—
Process type—Vapor deposition[2]
Wafer size—6 inch[2]
Vintage—1994[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing