Waferpedia

Comparison ledger

0020 23839 PartversusRaider ECD Electroplating

Applied Materials 0020 23839 Part, Semitool Raider ECD Electroplating, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0020 23839 PartApplied Materials
OEMApplied MaterialsSemitool
CategoryDepositionDeposition
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0020 23839 PartSemitool Raider ECD
Specifications
ConfigurationPlate, Sensor Clamp, Hdpcvd Ultima +[1]5 Wire[2]
Phase—3 Phase[2]
Voltage—208 V[2]
Wafer size—300 mm[3]
Electrical specification—3 Phase, 208 V, 5 Wire, 50/60 Hz, 125 amp[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]fabsurplus.comfabsurplus.com