Waferpedia

Comparison ledger

0021 20868 PartversusHX 750 Chiller

Applied Materials 0021 20868 Part, Neslab HX 750 Chiller, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0021 20868 PartApplied Materials
OEMApplied MaterialsNeslab
CategoryLab & Support EquipmentLab & Support Equipment
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials 0021 20868 PartNeslab HX 750
Specifications
ConfigurationBar, Bus, Gnd, Turbo Cb Encl, Gen Rack,[1]Needs heat exchanger to operate[2]
Model—HX 750[2]
Cooling capacity at 20°C—24,000 watts[3]
Standard temperature range—5°C to 35°C[3]
Condenser—air or water cooled[3]
Pump performance, 60 Hz, Pump 1—23 gpm at 50 psig (TU 9)[3]
Pump performance, 60 Hz, Pump 2—19 gpm at 50 psig (CP 75)[3]
Power requirements, 60 Hz—208-230V 3ø/460V 3ø[3]
Cooling capacity at 20C—24,000 Watts[4]
Available voltage—200-230V/460 3 Ph[4]
Flow rate at 20ºC / 50 PSI (TU9 Pump)—23 GPM[4]
Flow rate at 20ºC / 50 PSI (CP75 Pump)—19 GPM[4]
Temperature range—5C to 35C[4]

Plan your fab

Building a Lab & Support Equipment process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]industrial-stores.comindustrial-stores.com
  4. [4]trilliumus.comtrilliumus.com