Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Besi 2200 APM+ Die Attach, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | |
|---|---|---|
| OEM | Applied Materials | Besi |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Besi 2200 |
| Specifications | ||
| Configuration | — | Issue with the Injector[1] |
| OEM | — | Besi / Datacon[1] |
| Model | — | 2200 APM+[1] |
| Machine type | — | Die Attach[1] |
| Description | — | High-accuracy multi-chip die bonder[2] |
| Applications | — | Die attach; flip chip applications[2] |
| Wafer handling | — | 12 in[2] |
| Options/features | — | Integrated dispenser; automatic tool changer; application specific tooling[2] |
| Vintage | — | 2001[2] |
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