Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, Hesse & Knipps BJ 939, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | BJ 939Hesse & Knipps |
|---|---|---|
| OEM | Applied Materials | Hesse & Knipps |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | Hesse & Knipps (H&K) BJ 939 |
| Specifications | ||
| Configuration | — | 60° Bondhead[1] |
| Model | — | BJ 939[1] |
| Category | — | Packaging & Bonding[2] |
| Description | — | Fully Automatic Heavy Wire Bonder[3] |
| Bondhead | — | 60° Bondhead[1] |
| Make | — | Hesse & Knipps (H&K)[1] |
| Equipment type | — | Wire Bonder[1] |
| Line | — | Bondjet BJ93X[3] |
| E-box | — | E-box[1] |
| Condition | — | Refurbished[1] |
| Vintage | — | 2012[1] |
| Working area | — | 350 mm x 560 mm (13.8" x 22.0")[4] |
| Z travel | — | 70 mm (2.75")[4] |
| P-rotation | — | 440°[4] |
| Ultrasonic power output | — | 100 W programmable[4] |
| Wire range | — | Al, Cu, AlCu: 50 µm – 600 µm (2 mil – 24 mil), application-dependent[4] |
| Ribbon range | — | Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm (Cu: 200 µm)[4] |
| Machine dimensions | — | 750 x 1560 x 1.897 mm (29.9" x 61.4" x 74.7")[4] |
| Machine mass | — | appr. 1400 kg[4] |
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