Comparison ledger
Applied Materials 0041-26723 Bonded Assembly, MRSI H3, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 0041-26723 Bonded AssemblyApplied Materials | H3MRSI |
|---|---|---|
| OEM | Applied Materials | MRSI |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2019 Renamed product name · 2019 Name change for shipments |
| Control system | — | — |
| Generation | — | — |
| Family | Applied Materials 0041-26723 Bonded Assembly | MRSI H3 |
| Cited variants | — | |
| Specifications | ||
| Placement accuracy (3 sigma, before improvement) | — | ±3 micrometers[1] |
| Placement accuracy (3 sigma, after improvement) | — | ±1.5 micrometers[1] |
| Product line type | — | high-speed, high-precision and flexible eutectic and epoxy die bonding systems[1] |
| Product type | — | Die bonder[2] |
| Name change | — | Former name of the MRSI-H product[2] |
| Shipment rename date | — | October 1, 2019[1] |
| Placement accuracy | — | ±1.5 micrometers at 3 sigma[1] |
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