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Comparison ledger

0041-39086 ESC PartversusDPS II

Applied Materials 0041-39086 ESC Part, Applied Materials DPS II, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
0041-39086 ESC PartApplied Materials
DPS IIApplied Materials
OEMApplied MaterialsApplied Materials
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Applied Materials DPS
Cited variants—
Specifications
Configuration—Load port (3)[2]
OEM—Applied Materials[2]
Model—DPS II[2]
Category—Etch[1]
Wafer size—12 inch[2]
Tool class—second-generation 300mm tool[3]
Process capability—silicon or metal etch[3]
Scaleability—scaleable for 200mm wafers[3]
Onboard subsystems—controller, endpoint, and gas panel located onboard the tool[3]
Footprint—20 percent smaller than previous 200mm DPS models[3]
Demonstrated CD uniformity—less than 10nm across a 300mm wafer, including the edge die[3]
Demonstrated metal etch CD uniformity—less than five-percent from wafer to wafer and chamber to chamber[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]edn.comedn.com