Waferpedia

Comparison ledger

Mirra Mesa 3400versus12 Lapper

Applied Materials Mirra Mesa 3400, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
Mirra Mesa 3400Applied Materials
12 LapperLapmaster
OEMApplied MaterialsLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyApplied Materials Mirra Mesa 3400—
Specifications
ManufacturerApplied Materials[1]—
ModelMirra Mesa 3400[2]—
CategoryCMP[1]—
Outside plate diameter—12 inches[3]
Lapping Speed Range—0 to 60 rpm[4]
Wafer Size Compatibility—4 inches or smaller[3]
Input Voltage—110 V[3]
Frequency—60 Hz[3]
Phase—1[3]
Number of Rings—3[3]
Number of Weights—3[3]
Includes Slurry System—Yes[3]
Includes Timer—Yes[3]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]jmind.comjmind.com
  4. [4]etd.ohiolink.eduetd.ohiolink.edu