Waferpedia

Comparison ledger

AB 559 A 06versus10490

ASM AB 559 A 06, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
10490West Bond
OEMASMWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyASM AB 559West Bond 10490
Specifications
Voltage230 VAC[1]—
Configuration5 Amps[2]—
Power800W[1]—
MakeASM[2]—
ModelAB 559 A 06[2]10490[4]
TypeDie Bonder[2]—
Current5 Amps[1]—
Frequency50/60Hz[1]—
Machine typeWedge Bonder[3]—
Software version2.42[3]—
Vintage2005[3]—
Manufacturer—West Bond[4]
Description—Convertible bonder, wedge to ball[5]
Tool type—Convertible bonder[6]
Bonding modes—Wedge bonding and ball bonding[6]
Use—Wire bonding[6]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]Equipment inventory listing
  5. [5]fabsurplus.comfabsurplus.com
  6. [6]waferpedia.comwaferpedia.com