Waferpedia

Comparison ledger

Eagle 60versus101-149-053 Gold Booster

ASM Eagle 60, Branson 101-149-053 Gold Booster, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
OEMASMBranson
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run2002–—
Lifecycle——
Lifecycle milestones2002 launch—
Control system——
Generation——
FamilyASM Eagle 60Branson 101-149-053 Gold Booster
Specifications
Voltage240 V[1]—
Configuration50/60 Hz[1]1:1.5[4]
Phase1 Phase[1]—
Frequency50/60 Hz[1]—
Minimum bond pitch35 micron[2]—
Wire typeGold[2]—
Productivity improvement20% higher than predecessor[2]—
Wire bonding typeGold wire bonding[2]—
Fine pitch capability35 microns[2]—
Equipment typeWire Bonder[1]—
MakeASM[1]—
ModelEagle 60[1]101-149-053[5]
Power240 V, 50/60 Hz, 1 Phase[1]—
Bonding capability35-micron fine pitch bonding[2]—
Productivity20-percent higher productivity than its predecessor model[2]—
Manufacturer—Branson[5]
Type—Gold Booster[5]
Operating frequency—20 kHz[6]
Gain—1:1.5[5]
Mounting thread—1/2-20[6]
Length—5.4 in[6]
Gain ratio—1:1.5[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]waferpedia.comwaferpedia.com
  6. [6]nextdayautomation.comnextdayautomation.com