Comparison ledger
ASM Eagle Xtreme, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Eagle XtremeASM | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | ASM | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | ASM Eagle | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Configuration | Last used to bond thin gold wire with diameter of 50um or 2 mils. But software can be changed to other configurations.[1] | — |
| OEM | ASM[2] | — |
| Model | Eagle Xtreme[2] | — |
| Equipment type | Wire Bonder[2] | — |
| Last used application | Bond thin gold wire[1] | — |
| Wire diameter | 50um or 2 mils[1] | — |
| Wafer Size | — | 6 inch[3] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →