Comparison ledger
Axcelis 200 ACU, Lam Research 490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 200 ACUAxcelis | 490Lam Research |
|---|---|---|
| OEM | Axcelis | Lam Research |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Axcelis NV GSD 200 | Lam Research 490 |
| Specifications | ||
| Configuration | Parts Machine[1] | — |
| Manufacturer | Axcelis[1] | — |
| Model | 200 ACU[1] | — |
| Tool type | Asher[1] | Auto Etcher[5] |
| Wafer size | 200mm[3] | 4"~6"[6] |
| Serial number | AU6A356AH[3] | — |
| Computer system | M 200 PC, M 200[4] | — |
| Part number | SC 4572 A[4] | — |
| Volts | 208[4] | — |
| Amps | 30[4] | — |
| Equipment type | Asher[1] | — |
| Wafer configuration | 8 inch[2] | — |
| Process type | — | Plasma etcher[6] |
| Wafer size range | — | 3-inch to 6-inch wafers[7] |
| Wafer handling | — | Cassette-to-cassette automatic wafer handling[6] |
| Processing mode | — | Single-wafer processing[7] |
| Load lock | — | Vacuum load locked[7] |
| Control | — | Fully automated microprocessor control[7] |
| Electrode spacing | — | Programmable, variable electrode spacing[7] |
| Endpoint detection | — | Included[7] |
| Wafer size (typical) | — | 4"~6"[6] |
| Chamber architecture | — | Double airlock structure, vacuum load locked[6] |
| RF generator | — | Included[6] |
| Process gas control | — | Multiple process gas lines with MFC control[6] |
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