Comparison ledger
Besi 2200 EVO Die Bonder Hybrid, Branson 101-149-053 Gold Booster, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 101-149-053 Gold BoosterBranson | |
|---|---|---|
| OEM | Besi | Branson |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Besi 2200 EVO Die Bonder Hybrid | Branson 101-149-053 Gold Booster |
| Specifications | ||
| vintage | 2012[1] | — |
| Manufacturer | Besi[3] | Branson[6] |
| Model | 2200 EVO Die Bonder Hybrid[2] | 101-149-053[6] |
| Equipment type | die bonder hybrid[4] | — |
| Category | Packaging & Bonding[3] | — |
| OEM name | Besi / Datacon[1] | — |
| Configuration | — | 1:1.5[5] |
| Type | — | Gold Booster[6] |
| Operating frequency | — | 20 kHz[7] |
| Gain | — | 1:1.5[6] |
| Mounting thread | — | 1/2-20[7] |
| Length | — | 5.4 in[7] |
| Gain ratio | — | 1:1.5[6] |
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