Waferpedia

Comparison ledger

18 D SurfaceversusDFG 850 Back

Blanchard 18 D Surface, Disco DFG 850 Back, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceDisco DFG
Specifications
Voltage416 V[1]—
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[2]—
Model18 D[2]DFG 850[5]
Asset #153970[1]—
Power416 V, 3 phase[2]200-208 V, 50/60 Hz, 3 Phase[4]
Spindle Type—Air Bearings[4]
Maximum Spindle Speed—7,000 RPM[4]
External Cooling—Water Cooled[4]
Configuration—Disco DVC 011 Vacuum Coolant Unit[4]
Associated Coolant Unit—Disco DVC 011 Vacuum Coolant Unit[4]
Wafer Sizes—8 inch[5]
Vacuum Coolant Unit—Disco DVC 011[4]
OEM—Disco[5]
Equipment type—Back Grinder[5]
Related unit—Disco DVC 011 Vacuum Coolant Unit[4]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]Equipment inventory listing