Comparison ledger
Blanchard 18 D Surface, Disco DFG 8830, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 18 D SurfaceBlanchard | DFG 8830Disco |
|---|---|---|
| OEM | Blanchard | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Blanchard 18 D Surface | Disco DFG |
| Specifications | ||
| Voltage | 416 V[1] | — |
| Phase | 3 Phase[1] | 3 Phase[4] |
| Cycles | 50[1] | — |
| Control Voltage | 110[1] | — |
| Make | Blanchard[2] | Disco[4] |
| Model | 18 D[2] | DFG 8830[4] |
| Asset # | 153970[1] | — |
| Power | 416 V, 3 phase[2] | — |
| Configuration | — | In-Feed[4] |
| Wafer size | — | 6 inch, 8 inch[4] |
| Material | — | SiC (silicon carbide)[4] |
| Max workpiece size | — | ø150 mm[5] |
| Spindle quantity | — | 4[5] |
| Spindle power (Z1–Z3) | — | 6.3 kW[5] |
| Spindle speed (Z1–Z3) | — | 1,000–4,000 min⁻¹[5] |
| Work disc quantity | — | 5[5] |
| Dimensions (W×D×H) | — | 1,400 × 2,500 × 2,000 mm[5] |
| Weight | — | ≈6,000 kg[5] |
| Maximum workpiece size | — | 150 mm (6 inch)[5] |
| Wafer sizes supported | — | 6 inch and 8 inch[4] |
| Spindle count | — | 4[5] |
| Spindle speed range | — | 1,000 – 4,000 min⁻¹[5] |
| Number of work stations | — | 5[5] |
| Dimensions (W x D x H) | — | 1,400 x 2,500 x 2,000 mm[5] |
| Material compatibility | — | SiC[4] |
| In-feed capability | — | Yes[6] |
| Power supply | — | 3 Phase, 3 Wire + Ground, 60 A[6] |
| Category | — | Dicing & Grinding[6] |
| Tool type | — | wafer grinder[6] |
| Wafer sizes | — | 6, 8 inch[4] |
| Work station count | — | 5[5] |
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