Waferpedia

Comparison ledger

18 D SurfaceversusDS 266

Blanchard 18 D Surface, Meyer Burger DS 266, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
DS 266Meyer Burger
OEMBlanchardMeyer Burger
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceMeyer Burger DS 266
Specifications
Voltage416 V[1]400V[4]
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[2]—
Model18 D[2]—
Asset #153970[1]—
Power416 V, 3 phase[2]—
Configuration—120A[4]
Frequency—50 Hz[4]
Current—120 A[4]
Vintage—2008[4]
Wafer Size—8 inch[5]
Includes HDD & Software—Yes[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing
  5. [5]inventory listing