Waferpedia

Comparison ledger

18 D Surfaceversus7 AF Wafer Backside

Blanchard 18 D Surface, Strasbaugh 7 AF Wafer Backside, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
OEMBlanchardStrasbaugh
CategoryDicing & GrindingDicing & Grinding
Wafer size—Wafer Handler
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceStrasbaugh 7 AF Wafer Backside
Specifications
Voltage416 V[1]208 V[4]
Phase3 Phase[1]3 Phase[4]
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[2]—
Model18 D[2]—
Asset #153970[1]—
Power416 V, 3 phase[2]—
Frequency—60 Hz[4]
Wafer size—Wafer Handler[4]
Robot Type—Genmark[4]
System SW (App) Version—7.26.0[4]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]inventory listing