Waferpedia

Comparison ledger

18 D SurfaceversusMWS-44SN

Blanchard 18 D Surface, Takatori MWS-44SN, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
18 D SurfaceBlanchard
MWS-44SNTakatori
OEMBlanchardTakatori
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 18 D SurfaceTakatori MWS-44SN
Specifications
Voltage416 V[1]—
Phase3 Phase[1]—
Cycles50[1]—
Control Voltage110[1]—
MakeBlanchard[1]—
Model18 D[1]—
Asset #153970[1]—
Power416 V, 3 phase[1]—
Equipment type—Multi Wire Saw[3]
Product line—MWS[3]
Process category—Slicing and grinding[3]
Machine type—Multi wire saw[3]
Rocking motion-slicing mechanism—Allows easier abrasive outlet and smoothness of cutting surface to simplify subsequent processes[4]
Slurry supply—Effective lapping with slurry supplied from the nearest nozzle to the works for uniform and precise cutting[4]
Wire control—Direct drive system[4]
Wire control benefit—Saves space and allows speedy cutting[4]
Wire tension control—Electric control with stable wire tension[4]
Control method—Microcomputer-controlled cutting conditions for various work pieces[4]
Cutting recipes—60 cutting recipes settable[4]
Wire winding—Automatic wire winding[4]
Slurry compatibility—Diamond slurry compatible[4]
Listed materials—Sapphire, SiC, GaN, Quartz Crystal, Ceramic[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]Equipment inventory listing
  3. [3]takatori-g.co.jptakatori-g.co.jp
  4. [4]takatori-g.co.jptakatori-g.co.jp
  5. [5]diagon.aidiagon.ai