Waferpedia

Comparison ledger

20 36 Surfaceversus641 Dicing

Blanchard 20 36 Surface, Disco 641 Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
20 36 SurfaceBlanchard
OEMBlanchardDisco
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBlanchard 20 36 SurfaceDisco 641 Dicing
Specifications
ConfigurationWith new Elecro-Matic Neutrol II Magnetic Chuck Control[1]50/60 Hz[3]
Magnetic Chuck ControlElectro-Matic Neutrol II[1]—
Typesurface grinder[1]—
Applicationdicing and grinding[2]—
Magnetic chuck controlElectro-Matic Neutrol II Magnetic Chuck Control[2]—
Condition notelow hours[1]—
Maximum Power—AC 200 V[3]
Phase—3 Phase[3]
Power—4 kVA[3]
Manufacturer—Disco[4]
Model—641[4]
Tool type—Dicing saw[4]
Maximum power—AC 200 V, 50/60 Hz, 3 phase, 4 kVA[3]
Vintage—2003[3]

Plan your fab

Building a Dicing & Grinding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com