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Comparison ledger

101-149-053 Gold Boosterversus510

Branson 101-149-053 Gold Booster, EV Group 510, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
510EV Group
OEMBransonEV Group
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterEV Group 510
Specifications
Configuration1:1.5[1]230 / 400 V[4]
ManufacturerBranson[2]EV Group[5]
Model101-149-053[2]510[4]
TypeGold Booster[2]—
Operating frequency20 kHz[3]—
Gain1:1.5[2]—
Mounting thread1/2-20[3]—
Length5.4 in[3]—
Gain ratio1:1.5[2]—
Power Consumption—13,2 kW[4]
Full Load Current Rating—24,7 A[4]
Largest Current Rating—24,7 A[4]
Vacuum Pump—Edwards nXD 56 i Scroll Pump[4]
Equipment type—Bonder[6]
Power supply—230 / 400 V[4]
Frequency—50/60 Hz[4]
Maximum contact force—10 kN[5]
Heater size—150 mm and 200 mm[5]
Vacuum—Standard: 0.1 mbar; Optional: 1E-5 mbar[5]
Maximum temperature—550 °C[5]
Single chips processing—Yes[5]
Power supply for anodic bonding—Max. voltage: 2 kV; Max. current: 50 mA[5]
Loading chamber—Manual[5]

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Sources (6)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]nextdayautomation.comnextdayautomation.com
  4. [4]inventory listing
  5. [5]evgroup.comevgroup.com
  6. [6]waferpedia.comwaferpedia.com