Waferpedia

Comparison ledger

101-149-053 Gold Boosterversus850 Wafer

Branson 101-149-053 Gold Booster, EV Group 850 Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
850 WaferEV Group
OEMBransonEV Group
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyBranson 101-149-053 Gold BoosterEV Group 850
Cited variants—
  • EVG 850 Wafer Bonder (2001)[1]
  • EVG 850 Wafer Bonder (2012)[2]
Specifications
Configuration1:1.5[3]50/60 Hz[2]
ManufacturerBranson[4]EVG[2]
Model101-149-053[4]850 Wafer[2]
TypeGold Booster[4]—
Operating frequency20 kHz[5]—
Gain1:1.5[4]—
Mounting thread1/2-20[5]—
Length5.4 in[5]—
Gain ratio1:1.5[4]—
Power Consumption—28,9 kW[2]
Full Load Current Rating—89,1 A[2]
Largest Current Rating—28,9 A[2]
Power—5.5 kW[1]
Voltage—120/208 V, 3 Phase[1]
Category—Packaging & Bonding[2]
Wafer sizes—2, 3, 4, 5, 6, 8, 12 inch[2]
Wafer size limit—up to 8 inch[2]
Frequency—50/60 Hz[2]
Vintage—2001[1]
Power Consumption (2012 variant)—28.9 kW[2]
Full Load Current Rating (2012 variant)—89.1 A[2]
Largest Current Rating (2012 variant)—28.9 A[2]
AC Frequency—50/60 Hz[2]
Power (2001 variant)—5.5 kW[1]
Voltage (2001 variant)—120/208 V, 3 Phase[1]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]nextdayautomation.comnextdayautomation.com