Comparison ledger
Disco 321, Disco DFD 6341 Fully Automatic Dicing, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 321Disco | |
|---|---|---|
| OEM | Disco | Disco |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco 321 | Disco DFD 6341 Fully Automatic Dicing |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | 321[1] | — |
| Equipment type | Wafer Dicing Saw[1] | — |
| Facility context | Cleanroom Instrumentation[1] | — |
| Application area | Nano and Micro Fabrication[1] | — |
| Location | FNT 4.106[1] | — |
| Wafer Size | Up to 6 inches[2] | — |
| Spindle Power | 1.0 kW Synchro Spindle (or 1.5 kW Synchro Spindle in some configurations)[3] | — |
| Spindle Power (alternate) | 1500 Watt spindle[2] | — |
| Non-Contact Setup | Non Contact Setup[3] | — |
| Microscope | Microscope With Eyepiece and Shutter (or Dual Objective Microscope With Eyepiece)[3] | — |
| Broken Blade Detection | Broken Blade Detection[3] | — |
| Light Tower | Includes Light Tower[3] | — |
| Chuck Type | 6" Universal Chuck (or 6" Porous Film Frame Chuck)[2] | — |
| Wafer size capability | Up to 6" wafers[3] | — |
| Chuck | 6-inch porous film frame chuck[2] | — |
| Spindle power | 1500-watt spindle[2] | — |
| Footprint | Small footprint[2] | — |
| Setup | Non-contact setup[3] | — |
| Blade break detection | Broken blade detection[3] | — |
| Other features | Floppy drive, light tower, blade tools, manuals[3] | — |
| Facility area | Nano and Micro Fabrication[1] | — |
| Wafer size | up to 6" wafers[3] | — |
| Max workpiece size | — | Φ8 inch[4] |
| X-axis Cutting range | — | 210 mm[4] |
| Cutting speed | — | 0.1 to 1,000 mm/s[4] |
| Y1･Y2-axis Cutting range | — | 210 mm[4] |
| Index step | — | 0.0001 mm[4] |
| Positioning accuracy | — | Within 0.002/210 (Single error), Within 0.002/5[4] |
| Z-axis Max stroke | — | 19.22 mm (for Φ2 inch blade), 19.9 mm (for Φ3 inch blade)[4] |
| Z-axis Moving resolution | — | 0.00005 mm[4] |
| Z-axis Repeatability accuracy | — | 0.001 mm[4] |
| θ-axis Max rotating angle | — | 380 deg[4] |
| Spindle rated torque | — | 0.19 N·m (1.2 kW/High speed rotation), 0.29 N·m (1.8 kW), 0.7 N·m (2.2 kW?)[4] |
| Spindle rotation speed range | — | 6,000 – 60,000 min⁻¹ (1.2 kW/1.8 kW), 20,000 – 80,000 min⁻¹ (High speed rotation), 3,000 – 30,000 min⁻¹ (2.2 kW?)[4] |
| Equipment dimensions (W×D×H) | — | 1,180 × 1,080 × 1,820 mm[4] |
| Equipment weight | — | Approx. 1,500 kg[4] |
| Optional high-speed flash alignment speed | — | 600 mm/s[4] |
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