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Comparison ledger

641 Dicingversus15

Disco 641 Dicing, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
15Lapmaster
OEMDiscoLapmaster
CategoryDicing & GrindingDicing & Grinding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyDisco 641 DicingLapmaster 15
Specifications
Maximum PowerAC 200 V[1]—
Configuration50/60 Hz[1]—
Phase3 Phase[1]—
Power4 kVA[1]—
ManufacturerDisco[2]—
Model641[2]—
Tool typeDicing saw[2]—
Maximum powerAC 200 V, 50/60 Hz, 3 phase, 4 kVA[1]—
Vintage2003[1]—
Input Power—110 Vac[3]
Plate Diameter—15 inches (381 mm)[4]
Number of Conditioning Rings—3[4]
Ring ID—5.5 inches (140 mm)[4]
Standard RPM—60[4]
RPM Range (Variable Speed Drive)—0-60[4]
Drive Motor - Lapper—0.5 HP (0.37 kW)[4]
Drive Motor - Polisher—0.75 HP (0.56 kW)[4]
Length—25 inches (635 mm)[4]
Width—20 inches (508 mm)[4]
Height—24 inches (610 mm)[4]
Estimated Shipping Weight—285 lbs (129.3 kg)[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]web.archive.orgweb.archive.org