Comparison ledger
Disco DAD 3221 Automatic Dicing, Meyer Burger OC 266 Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | OC 266 WaferMeyer Burger | |
|---|---|---|
| OEM | Disco | Meyer Burger |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DAD | Meyer Burger OC 266 Wafer |
| Specifications | ||
| Power | 2000W synchro spindle (3.000 – 40.000 rpm)[2] | — |
| Configuration | 6” porous chuck table for 6” frames[2] | 150A[4] |
| Machine dimensions | 490mm x 870mm x 1.670mm[2] | — |
| Make | Disco[2] | — |
| Model | DAD 3221[2] | — |
| Machine type | Automatic Dicing Saw[2] | — |
| Wafer size | 6 inch[2] | — |
| Spindle layout | Single[3] | — |
| Spindle output | 2000 W synchro spindle[2] | — |
| Spindle speed range | 3,000–40,000 rpm[2] | — |
| Chuck table | 6-inch porous chuck table for 6-inch frames[2] | — |
| Max workpiece size | Φ6 inch; optional 150 mm × 150 mm user-specified specification[3] | — |
| X-axis cutting range | 160 mm[3] | — |
| Y-axis cutting range | 162 mm[3] | — |
| Equipment dimensions | 490 mm × 870 mm × 1,670 mm[2] | — |
| Internal transformer / power | 380–420 V, 3 phases, 50 Hz[2] | — |
| CE marking | 2022[2] | — |
| Spindle power | 2.0 kW (standard), 1.8 kW (option)[3] | — |
| Z-axis max stroke | 32.2 mm (for 2 inch blades)[3] | — |
| θ-axis max rotating angle | 320 deg[3] | — |
| Machine dimensions (W×D×H) | 490 mm × 870 mm × 1,670 mm[3] | — |
| Machine weight | approx. 420 kg[3] | — |
| Microscope magnification | 7.5x with 1/2 inch CCD, field of view 0.64 mm[2] | — |
| LCD monitor | 15 inch[2] | — |
| Power supply | 380-420 V, 3 phases, 50 Hz (internal transformer)[2] | — |
| X-axis cutting speed | 0.1 – 800 mm/s[3] | — |
| Y-axis index step | 0.0001 mm[3] | — |
| Y-axis positioning accuracy | 0.005 mm / 160 mm (single error)[3] | — |
| Z-axis moving resolution | 0.000002 mm[3] | — |
| Z-axis repeatability accuracy | 0.001 mm[3] | — |
| Rated torque (2.0 kW spindle) | 0.48 N·m[3] | — |
| Voltage | — | 400V[1] |
| Frequency | — | 50 Hz[1] |
| Type | — | wafer saw[1] |
| Category | — | Dicing & Grinding[1] |
| Current | — | 150A[1] |
Plan your fab
Building a Dicing & Grinding process? Get a complete equipment list.
Open the fab equipment planner →