Comparison ledger
EV Group 510, EV Group 510 Wafer, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 510EV Group | 510 WaferEV Group |
|---|---|---|
| OEM | EV Group | EV Group |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | Manual wafer load substrate bonder |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 510 | EV Group 510 |
| Specifications | ||
| Configuration | 230 / 400 V[1] | Refurbished[4] |
| Power Consumption | 13,2 kW[1] | — |
| Full Load Current Rating | 24,7 A[1] | — |
| Largest Current Rating | 24,7 A[1] | — |
| Vacuum Pump | Edwards nXD 56 i Scroll Pump[1] | — |
| Manufacturer | EV Group[2] | EV Group[4] |
| Model | 510[1] | 510 Wafer[4] |
| Equipment type | Bonder[3] | — |
| Power supply | 230 / 400 V[1] | — |
| Frequency | 50/60 Hz[1] | — |
| Maximum contact force | 10 kN[2] | — |
| Heater size | 150 mm and 200 mm[2] | 150 mm, 200 mm[2] |
| Vacuum | Standard: 0.1 mbar; Optional: 1E-5 mbar[2] | Standard: 0.1 mbar; optional: 1E-5 mbar[2] |
| Maximum temperature | 550 °C[2] | — |
| Single chips processing | Yes[2] | Yes[2] |
| Power supply for anodic bonding | Max. voltage: 2 kV; Max. current: 50 mA[2] | Max voltage 2 kV; max current 50 mA[2] |
| Loading chamber | Manual[2] | Manual[2] |
| Wafer size | — | Manual wafer load substrate bonder[4] |
| Max Bond Force | — | 10 kN[4] |
| Top side heater | — | 550°C max. in 1°C steps[4] |
| Bottom side heater | — | 550°C max. in 1°C steps[4] |
| Temperature uniformity | — | ± 1,5 % Turbo pump and controller[4] |
| Category | — | Packaging & Bonding[5] |
| Wafer handling | — | Manual wafer load substrate bonder[5] |
| Bonding capability | — | Fusion and thermal compression bonding[4] |
| Bond chamber | — | High-vacuum capable bond chamber[5] |
| Control software | — | Windows based control software and operation interface[4] |
| Turbo pump and controller | — | Included[4] |
| Roughing pump | — | Included[4] |
| System chiller | — | Included[4] |
| Load/unload tool | — | Included[4] |
| System computer, monitor, and keyboard | — | Included[4] |
| Max temperature | — | 550 °C[2] |
| Max contact force | — | 10, 20, 60 kN[2] |
| Active water cooling | — | For bottom side[2] |
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