Comparison ledger
EV Group 510, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 510EV Group | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | EV Group | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | EV Group 510 | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Configuration | 230 / 400 V[1] | — |
| Power Consumption | 13,2 kW[1] | — |
| Full Load Current Rating | 24,7 A[1] | — |
| Largest Current Rating | 24,7 A[1] | — |
| Vacuum Pump | Edwards nXD 56 i Scroll Pump[1] | — |
| Manufacturer | EV Group[2] | — |
| Model | 510[1] | — |
| Equipment type | Bonder[3] | — |
| Power supply | 230 / 400 V[1] | — |
| Frequency | 50/60 Hz[1] | — |
| Maximum contact force | 10 kN[2] | — |
| Heater size | 150 mm and 200 mm[2] | — |
| Vacuum | Standard: 0.1 mbar; Optional: 1E-5 mbar[2] | — |
| Maximum temperature | 550 °C[2] | — |
| Single chips processing | Yes[2] | — |
| Power supply for anodic bonding | Max. voltage: 2 kV; Max. current: 50 mA[2] | — |
| Loading chamber | Manual[2] | — |
| Wafer Size | — | 6 inch[4] |
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