Comparison ledger
EV Group Gemini Automated Production Fusion, SUSS MicroTec ELP300 Gen2, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | ELP300 Gen2SUSS MicroTec | |
|---|---|---|
| OEM | EV Group | SUSS MicroTec |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | 300mm | 300mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2014 Launch announcement |
| Control system | — | — |
| Generation | — | Gen2 |
| Family | EV Group Gemini Automated | SUSS MicroTec ELP300 Gen2 |
| Specifications | ||
| Configuration | Interlocked doors with signal light tower[1] | — |
| Wafer Size | 12"/300mm[1] | up to 300 mm[2] |
| Alignment Module | SmartView NT with 5x objectives[1] | — |
| Robot | 4-Axis Industrial Robot[1] | — |
| Software | EVG CIM Framework Software GUI[1] | — |
| Certification | CE Certified[1] | — |
| Wafer Loading | FOUP loading with empty/present sensor[1] | — |
| Automation | — | Automated[2] |
| Laser Type | — | Excimer Laser[2] |
| Processes | — | Alignment, Ablation, Laser-Assisted Debonding, Laser Seed Layer Removal[2] |
| Optics / laser type | — | Excimer Laser[3] |
| Wafer handling configuration | — | Configured for handling both 200 mm and 300 mm wafers[4] |
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