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Comparison ledger

NXT H Placementversus1707 EXL Reflow Soldering

Fuji NXT H Placement, Heller 1707 EXL Reflow Soldering, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
OEMFujiHeller
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyFuji NXT—
Specifications
ConfigurationH02 Head[1]—
Head typeH02 Head[1]—
Maximum chip size60mm x 60mm[1]—
Placement capabilitiesHigh density, low impact, semiconductor[2]—
Feeding methodsWafer and reel part placement, direct pickup from wafers[2]—
Drive systemLinear motor movement[2]—
Alignment systemHigh-resolution cameras[2]—
Cleanroom classClass 1000[2]—
User interface15-inch touchscreen panel[2]—
XY robot cleanroom capabilityCleanroom capable; HEPA filter option available[2]—
Make—Heller[3]
Model—1707 EXL[3]
Machine type—Reflow soldering machine / reflow soldering oven[3]
Vintage—2005[3]
Power input—Standard 208/240 VAC 3-phase[4]
Breaker size—100 amps @ 480 V[4]
Optional power inputs—380/400/440/415/480 VAC[4]
Frequency—50/60 Hz[4]
Overall length—134 in (340 cm)[4]
Overall width—54 in (137 cm)[4]
Overall height—63 in (160 cm)[4]
Typical net weight—3000 lbs (1360 kg)[4]
Operating system—Windows XP[4]
Top heating zones—7[4]
Bottom heating zones—7[4]
Cooling zones—1[4]
Heater type—Instant response open coil[4]
Heater material—Nichrome[4]
Temperature range—25-350°C standard; high temperature up to 450°C optional[4]
Maximum conveyor speed—74 in/min (188 cm/min)[4]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]smt.fuji.co.jpsmt.fuji.co.jp
  3. [3]Equipment inventory listing
  4. [4]efsmt.comefsmt.com