Comparison ledger
Hesse & Knipps BJ 939, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | BJ 939Hesse & Knipps | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | Hesse & Knipps | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hesse & Knipps (H&K) BJ 939 | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Configuration | 60° Bondhead[1] | — |
| Model | BJ 939[1] | — |
| Category | Packaging & Bonding[2] | — |
| Description | Fully Automatic Heavy Wire Bonder[3] | — |
| Bondhead | 60° Bondhead[1] | — |
| Make | Hesse & Knipps (H&K)[1] | — |
| Equipment type | Wire Bonder[1] | — |
| Line | Bondjet BJ93X[3] | — |
| E-box | E-box[1] | — |
| Condition | Refurbished[1] | — |
| Vintage | 2012[1] | — |
| Working area | 350 mm x 560 mm (13.8" x 22.0")[4] | — |
| Z travel | 70 mm (2.75")[4] | — |
| P-rotation | 440°[4] | — |
| Ultrasonic power output | 100 W programmable[4] | — |
| Wire range | Al, Cu, AlCu: 50 µm – 600 µm (2 mil – 24 mil), application-dependent[4] | — |
| Ribbon range | Al, Cu, AlCu: 250 µm x 25 µm up to 2000 µm x 400 µm (Cu: 200 µm)[4] | — |
| Machine dimensions | 750 x 1560 x 1.897 mm (29.9" x 61.4" x 74.7")[4] | — |
| Machine mass | appr. 1400 kg[4] | — |
| Wafer Size | — | 6 inch[5] |
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