Waferpedia

Comparison ledger

GKG GT++versusAccuflex

Juki GKG GT++, Speedline Accuflex, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Documented as functional equivalents— Same function class: Assembly / SMT, null[1]
Side-by-side comparison of selected equipment models
Attribute
AccuflexSpeedline
OEMJukiSpeedline
CategoryAssembly / SMTAssembly / SMT
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones—2003 Document date
Control system——
Generation——
Family—Speedline Accuflex
Specifications
Max PCB size510x510 mm[2]—
Min PCB size50x50 mm[2]—
PCB thickness0.4-6 mm[2]—
Max board weight5 kg[2]—
Transport height900±40 mm[2]—
Print speed10-200 mm/sec[2]5 mm to 200 mm/sec (0.2" to 7.87"/sec)[7]
Print pressure0.5-10 kg[2]—
Stencil frame size470x370 mm ~ 737x737 mm[2]737 mm x 737 mm (29" x 29")[7]
Repeat position accuracy±12.5um@6, CPK≥2.0[2]—
Print accuracy±18um@6, CPK≥2.0[2]—
Print cycle time< 7.5 sec[2]—
Power supplyAC:220±10%, 50/60Hz, 3.0KW[2]—
Air pressure4~6 kgf/cm²[2]—
Machine dimensions (L x W x H)1240 x 1410 x 1500 mm[2]—
Machine weightapprox 1100 kg[2]700 kg (1550 lb)[7]
Cleaning methodDry, wet, vacuum three modes[2]—
Camera typeCCD digital camera[2]—
Repeat position accuracy (alternative)±10um@6σ, CPK>2.0[3]—
Printing precision (alternative)±17um@6σ, CPK>2.0[3]—
Print cycle time (alternative)<7.5 sec (excluding cleaning and printing)[3]—
PCB thickness (alternative)0.4~15 mm[4]—
Repeat position accuracy (Flason)±0.01mm (test data and method available)[4]—
Printing accuracy (Flason)±0.025mm (test data and method available)[4]—
Print cycle time (Flason)<8 sec (exclude printing & cleaning)[4]—
Power supply (Flason)AC:220±10%, 50/60Hz, 1.5KW[4]—
Air consumption (Flason)approx 0.07 m³/min[4]—
Squeegee speed6-300 mm/sec[4]—
Squeegee pressure0-10 kg software control (closed-loop pressure feedback)[4]—
Configuration—220-240 V[5]
Power—1 KVA[5]
Largest Single Load—1 A[5]
Full Load Current—3 A[5]
Machine type—Fully automatic screen/stencil printer[1]
Application—Deposits print medium on circuit boards to enable application of surface mount components[1]
Category—Assembly / SMT[6]
Frequency—50/60 Hz[5]
Maximum board size—584 mm x 508 mm (23" x 20")[7]
Minimum board size—75 mm x 50 mm (3" x 2")[7]
Board thickness—0.8 mm to 5.0 mm including warpage[7]
Optional board thickness—0.2 mm to 3.8 mm including warpage[7]
Maximum board weight—4.5 kg (10 lb)[7]
Board edge clearance—5 mm (0.19")[7]
Optional board edge clearance—3 mm (0.12")[7]
Maximum underside clearance—15 mm (0.59")[7]
Board support methods—Independent, movable, automatic (option) magnetic support pins, dedicated fixturing, GridLok, Gel-Flex[7]
Maximum print area—559 mm x 498 mm (22" x 19.6")[7]
Snap-off—0.2 mm x 10 mm/sec (0.008" x 0.39"/sec)[7]
Print force—Up to 20 kg (44 lb)[7]
Print stroke—508 mm (20")[7]
Vision field-of-view—13 mm x 10 mm[7]
Vision system—Single camera with patented look up/down vision with Cognex 8100 vision system[7]
Vision alignment—±25 microns (±0.001") repeatability & accuracy at 6 Sigma, Cp greater than or equal to 2.0[7]
Print deposit repeatability—±50 microns (±0.002") at 6 Sigma, Cp greater than or equal to 2.0[7]
Cycle time—Standard single-rail conveyor system 11.5 sec; optional triple-track conveyor system 10.0 sec[7]
Air supply requirements—5 CFM at 90 psi, clean air supply, 1421/m @ 6.2 bar[7]
Height—1575 mm (62")[7]
Depth—1448 mm (57")[7]
Conveyor width—1314 mm (51.7")[7]
Cover width—1200 mm (47.25")[7]
Front clearance—679 mm (26.75") minimum[7]
Rear clearance—240 mm (9.45")[7]
Crated weight—1140 kg (2500 lb)[7]

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Sources (7)Every fact above is drawn from these public sources
  1. [1]scribd.comscribd.com
  2. [2]smt-innovation.comsmt-innovation.com
  3. [3]cnsmtline.comcnsmtline.com
  4. [4]flasonsmt.comflasonsmt.com
  5. [5]inventory listing
  6. [6]waferpedia.comwaferpedia.com
  7. [7]ibesmt.comibesmt.com