Comparison ledger
Kulicke & Soffa Rapid Pro Automatic, Shinkawa UTC 5000, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Rapid Pro AutomaticKulicke & Soffa | UTC 5000Shinkawa |
|---|---|---|
| OEM | Kulicke & Soffa | Shinkawa |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Kulicke & Soffa Rapid Pro Automatic | Shinkawa UTC |
| Cited variants | — | |
| Specifications | ||
| Power | Approx. 2.6 kVA[4] | — |
| Wire size (Au, Cu, Ag) | 0.6 to 2.5 mil[4] | — |
| Bond placement accuracy (3 sigma) | 2 µm[4] | — |
| Bonding area X | 56 mm[5] | — |
| Bonding area Y (standard) | 80 mm[2] | — |
| Bonding area Y (LA variant) | 87 mm[2] | — |
| Bonding area Y (ELA variant) | 80 mm[2] | — |
| Bonding method | Ball bonder[5] | — |
| Maximum wire length | 76 mm (with 1.0 mil wire)[2] | — |
| Minimum loop height | 40 µm (with 0.6 mil wire)[2] | — |
| Wire pitch | 35 µm[5] | — |
| Wire sway | 25 µm (wire length ≤ 2.54 mm)[5] | — |
| Power supply | 200-240 VAC, -15% to 10%, single phase, 50/60 Hz, 2.6 kVA[5] | — |
| Air consumption | 185 L/min[5] | — |
| Air pressure | 3.52 kg/cm²[5] | — |
| Net weight | 590 kg[5] | — |
| Dimensions (base machine with MHS) | 889 x 1003 mm[5] | — |
| Magazine dimensions | 305 x 110 x 178 mm[5] | — |
| Leadframe dimensions | 300 x 92 mm[5] | — |
| Same leadframe type conversion time | 4 min[5] | — |
| Different leadframe type conversion time | 8 min[5] | — |
| Die pad downset | Up to 2.3 mm[5] | — |
| Vision system | Higher resolution progressive scan, CCD camera + dual magnification (2x & 6x), optional programmable focus[2] | — |
| ROHS compliant | Yes[2] | — |
| Bonding Area (X x Y) | 56 x 80 mm[5] | — |
| Air Pressure | 3.52 kg/sq cm[5] | — |
| Bonding Wire Length | 7.6 mm[5] | — |
| Different Leadframe Type | 8 min (change time?)[5] | — |
| Gold Wire Size | 0.6 to 2.5 mil[5] | — |
| Minimum Loop Height | 40 µm[5] | — |
| Overall Dimensions (Base Machine with MHS) | x 889 x 1003 mm (first dimension not stated)[5] | — |
| Placement Accuracy | 2 µm[5] | — |
| Same Leadframe Type | 4 min (change time?)[5] | — |
| Wire Sway | 25 µm[5] | — |
| Power Consumption | Approx. 2.6 kVA[4] | — |
| Voltage | 200 / 220 / 240 VAC[4] | — |
| Frequency | 50/60 Hz[4] | — |
| Current | 15 A[4] | — |
| Phase | Single phase[4] | — |
| Manufacturer | Kulicke & Soffa Industries, Inc.[5] | — |
| Model | Rapid Pro Automatic[4] | — |
| Type | Automatic wire bonder[4] | Wire Bonder[1] |
| Material handling | Automatic magazine material handling[4] | — |
| Wire size | 0.6 to 2.5 mil Au, Cu, and Ag wire[4] | — |
| Placement accuracy | 2 um bond placement accuracy at 3 sigma[4] | — |
| Bonding area | 56 mm x 80 mm[5] | — |
| Vintage | 2020[4] | 2019[6] |
| Configuration | — | Complete with HDD[6] |
| Wafer Size | — | 12 inch[6] |
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