Waferpedia

Comparison ledger

Concept Two Speedversus100 ICP Fluorine

Lam Research Concept Two Speed, Oxford Instruments 100 ICP Fluorine, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
Concept Two SpeedLam Research
100 ICP FluorineOxford Instruments
OEMLam ResearchOxford Instruments
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research Concept TwoOxford Instruments 100 ICP Fluorine
Cited variants
  • Concept Two Speed S (A)[1]
—
Specifications
Configuration1 Shrink chamber[2]—
ManufacturerLam Research[3]—
Configuration optionShrink chamber[3]—
Asset #68566[2]—
MakeLam / Novellus[2]—
ModelConcept Two Speed[2]—
Process typeEtch chamber[1]—
PlatformNovellus Concept Two platform[1]—
Voltage208 VAC[1]—
Phase3 phase[1]—
Frequency50/60 Hz[1]—
TypeChamber Only[1]—
Full load current21 A[1]—
Main breaker rating25 A[1]—
Largest load8 A[1]—
Intended wafer size8 inch[4]—
Wafer shapeNotch[4]—
SMIF interfaceYes[4]—
Chamber configuration1 shrink chamber; 1 standard chamber[2]—
Largest load current8 A[1]—
Interrupt current10 KA[1]—
Vintage2010[1]—
Etch Gases—SF6, CF4, O2, Ar, N2, CHF3, C4F8[5]
Cryo DRIE etch rate—up to 5 µm/min[5]
Wafer size—4 inch, 6 inch, 8 inch (with clamp change)[5]

Plan your fab

Building a Etch process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]waferpedia.comwaferpedia.com
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]semistarcorp.comsemistarcorp.com
  5. [5]nanofab.utah.edunanofab.utah.edu