Comparison ledger
Lapmaster 12 Benchtop Lapping Polishing, Strasbaugh 6 DS SP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12 Benchtop Lapping PolishingLapmaster | 6 DS SPStrasbaugh |
|---|---|---|
| OEM | Lapmaster | Strasbaugh |
| Category | CMP | CMP |
| Wafer size | — | Single Wafer SiC Substrate |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lapmaster 12 Benchtop Lapping Polishing | Strasbaugh 6 DS SP |
| Specifications | ||
| Make | Lapmaster[1] | Strasbaugh[6] |
| Model | 12[1] | 6 DS SP[6] |
| Category | CMP[2] | — |
| Type/Application | Single sided[3] | — |
| Plate diameter | 12 in[3] | — |
| No. of conditioning rings | 3[4] | — |
| Configuration | Ring lapper[4] | Multi Process[6] |
| Base | Rigid, lightweight, cast aluminum base[4] | — |
| Standard RPM | 60 RPM[4] | — |
| RPM range with variable speed drive | 0-60[4] | — |
| Drive motor - lapper | 0.5 HP[4] | — |
| Drive motor - polisher | 0.75 HP[4] | — |
| Length | 25 in[4] | — |
| Width | 18 in[4] | — |
| Height | 24 in[4] | — |
| Estimated shipping weight | 240 lbs[4] | — |
| Approximate weight | 135 lbs / 61 kg[5] | — |
| Approximate dimensions | 24.5 in × 17.5 in × 23.8 in (622 mm × 445 mm × 607 mm)[5] | — |
| Electrical system | Various voltages; 50/60 Hz; 1 phase and 3 phase to customer specification[5] | — |
| Motor | 1/3 hp / 0.25 kW motor with gear reducer[5] | 36 A[7] |
| Abrasive feed system | Designed for water or oil based lapping slurries[5] | — |
| Automatic cycle timer | Automatic digital cycle timer[5] | — |
| Ring configuration | Ring lapper[4] | — |
| Ring ID | 4.25 inches[4] | — |
| Voltage | — | 208 V, 3 Phase, 60 Hz[7] |
| Full Load | — | 60 A[7] |
| Interrupting Capacity | — | 10,000 A[7] |
| Wafer size | — | Single Wafer SiC Substrate[7] |
| Equipment type | — | CMP (Chemical Mechanical Polisher)[6] |
| Wafer sizes | — | 8 inch[6] |
| Operating voltage | — | 208 V[7] |
| Phase | — | 3 Phase[7] |
| Frequency | — | 60 Hz[7] |
| Full load current | — | 60 A[7] |
| Motor current | — | 36 A[7] |
| Automation | — | Fully automated[7] |
| Material | — | Single Wafer SiC Substrate[7] |
| Wafer carriers | — | 2 x 150 mm wafer carriers; 1 x 150 mm wafer carriers[7] |
| Carrier rebuild kit | — | Acid resistance carrier rebuild kit[7] |
| Temperature control | — | Table temperature control unit (SMC chiller)[7] |
| Loading | — | Two cassette slots for loading[7] |
| Unloading | — | Two cassette slots for unloading[7] |
| Polish mode | — | Single sided polish[7] |
| Polish modules | — | 1 polish module equipped with dedicated hardware[7] |
| Pad conditioning | — | Programmable pad conditioning[7] |
| Spindle | — | Overam spindle with 4 passage rotary union[7] |
| Slurry dosing | — | Slurry perilstatic pump dosing on the table[7] |
| Vacuum | — | Universal vacuum pump[7] |