Waferpedia

Comparison ledger

12 Lapperversus100R16

Lapmaster 12 Lapper, Strasbaugh 100R16, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
100R16Strasbaugh
OEMLapmasterStrasbaugh
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Strasbaugh 100R16
Specifications
Outside plate diameter12 inches[1]—
Lapping Speed Range0 to 60 rpm[2]—
Wafer Size Compatibility4 inches or smaller[1]—
Input Voltage110 V[1]—
Frequency60 Hz[1]—
Phase1[1]—
Number of Rings3[1]—
Number of Weights3[1]—
Includes Slurry SystemYes[1]—
Includes TimerYes[1]—
type—1 spindle grinder/polisher[3]
drive system—DC drive system with 2 motors[3]
spindle RPM—1-180 RPM[3]
eccentric RPM—1-90 RPM[3]
controls—digital timer; air down switch; spindle and eccentric speed dials; air regulators[3]
capacity—16 inches[3]
spindle size—1-8 TPI[3]
overall dimensions—28 inches x 36 inches x 48 inches[3]
weight—500 lbs[3]
origin—made in the USA[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]jmind.comjmind.com
  2. [2]etd.ohiolink.eduetd.ohiolink.edu
  3. [3]excelltechnology.comexcelltechnology.com