Comparison ledger
Logitech 1 DP 41, Strasbaugh 6 DS SP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 DP 41Logitech | 6 DS SPStrasbaugh |
|---|---|---|
| OEM | Logitech | Strasbaugh |
| Category | CMP | CMP |
| Wafer size | — | Single Wafer SiC Substrate |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Logitech 1 DP 41 | Strasbaugh 6 DS SP |
| Specifications | ||
| Phase | 3 Phase[1] | 3 Phase[3] |
| Configuration | 50/60 Hz[1] | Multi Process[2] |
| Voltage | 480 V[1] | 208 V, 3 Phase, 60 Hz[3] |
| Make | Logitech[1] | Strasbaugh[2] |
| Model | 1 DP 41[1] | 6 DS SP[2] |
| Frequency | 50/60 Hz[1] | 60 Hz[3] |
| Current | 12 amps[1] | — |
| Full Load | — | 60 A[3] |
| Motor | — | 36 A[3] |
| Interrupting Capacity | — | 10,000 A[3] |
| Wafer size | — | Single Wafer SiC Substrate[3] |
| Equipment type | — | CMP (Chemical Mechanical Polisher)[2] |
| Wafer sizes | — | 8 inch[2] |
| Operating voltage | — | 208 V[3] |
| Full load current | — | 60 A[3] |
| Motor current | — | 36 A[3] |
| Automation | — | Fully automated[3] |
| Material | — | Single Wafer SiC Substrate[3] |
| Wafer carriers | — | 2 x 150 mm wafer carriers; 1 x 150 mm wafer carriers[3] |
| Carrier rebuild kit | — | Acid resistance carrier rebuild kit[3] |
| Temperature control | — | Table temperature control unit (SMC chiller)[3] |
| Loading | — | Two cassette slots for loading[3] |
| Unloading | — | Two cassette slots for unloading[3] |
| Polish mode | — | Single sided polish[3] |
| Polish modules | — | 1 polish module equipped with dedicated hardware[3] |
| Pad conditioning | — | Programmable pad conditioning[3] |
| Spindle | — | Overam spindle with 4 passage rotary union[3] |
| Slurry dosing | — | Slurry perilstatic pump dosing on the table[3] |
| Vacuum | — | Universal vacuum pump[3] |