Comparison ledger
Nordson Asymtek X 1020, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Asymtek X 1020Nordson | 10490West Bond |
|---|---|---|
| OEM | Nordson | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Nordson Asymtek | West Bond 10490 |
| Specifications | ||
| Configuration | 180-260 Volts[1] | — |
| Type | Fluid Dispenser[2] | — |
| Dispensing Technology | Jet, Needle, or Spray[2] | — |
| Control System | Windows-based software[2] | — |
| Accuracy | ±25 μm[2] | — |
| Resolution | 1 μm[2] | — |
| Fluid Types | Solder paste, adhesives, encapsulants, underfill[2] | — |
| Air Pressure Requirements | 80 psi (5.5 bar)[2] | — |
| Power | 180-260 Volts[1] | — |
| Max Current | 30A[1] | — |
| Manufacturer | — | West Bond[3] |
| Model | — | 10490[3] |
| Description | — | Convertible bonder, wedge to ball[4] |
| Tool type | — | Convertible bonder[5] |
| Bonding modes | — | Wedge bonding and ball bonding[5] |
| Use | — | Wire bonding[5] |
Plan your fab
Building a Packaging & Bonding process? Get a complete equipment list.
Open the fab equipment planner →