Comparison ledger
OAI Model 800E, Ultratech 1000 Family, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Model 800EOAI | 1000 FamilyUltratech |
|---|---|---|
| OEM | OAI | Ultratech |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | OAI Model 800E | Ultratech 1000 Family |
| Specifications | ||
| Product category | Mask aligner[1] | — |
| Operation mode | Semi-automatic[2] | — |
| Exposure sides | Frontside and backside[2] | — |
| Feature level | Advanced features and specifications found most often in costly automated production mask aligners[2] | — |
| System type | Front & backside semi-automatic mask aligner[3] | — |
| Platform | Built on OAI's modular platform[3] | — |
| Control system | Windows 10 control and recipe storage[4] | — |
| Alignment stages | Joystick-controlled alignment and optics stages[3] | — |
| Exposure modes | Vacuum contact, hard contact, soft contact, proximity[4] | — |
| Substrate size | Up to 8" square[4] | — |
| Mask size | Up to 9" x 9"[4] | — |
| Alignment cameras | Dual 1 MP GIGE CCD cameras; 4 total in backside configuration[4] | — |
| Wedge correction | Non-contact 3-point wedge effect correction / auto wedge effect compensation[4] | — |
| Optics | OAI Advanced Beam Optics[3] | — |
| UV source | High-intensity broadband Hg/Hg-Xe arc lamp (320-450 nm)[5] | — |
| Beam uniformity | Exceptional uniformity[3] | — |
| Resolution | Sub-micron capability with optimized resist and process[5] | — |
| Tool type | — | Photolithography step-and-repeat 1X stepper[6] |
| Optical design | — | Wynne Dyson[6] |
| Magnification | — | 1X[6] |
| Tool class | — | Photolithography step-and-repeat 1X steppers[6] |
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