Comparison ledger
PR Hoffman 108T, Strasbaugh 6 DS SP, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 108TPR Hoffman | 6 DS SPStrasbaugh |
|---|---|---|
| OEM | PR Hoffman | Strasbaugh |
| Category | CMP | CMP |
| Wafer size | up to 12 in wafers | Single Wafer SiC Substrate |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | PR Hoffman 108T | Strasbaugh 6 DS SP |
| Specifications | ||
| carrier type listing | 108T 9B - S/F / Lapmaster LSP-9 / etc.[1] | — |
| machine class | for double-sided planetary lapping & polishing machines[1] | — |
| wafer sizes stated on insert-carrier page | 3 in, 4 in, 5 in, 6 in, 8 in, and 12 in wafers[1] | — |
| maximum carrier diameter stated on insert-carrier page | up to 33 in diameter[1] | — |
| maximum carrier diameter stated on lapping-carrier page | up to 48 in diameter[2] | — |
| Model designation | 108T[3] | — |
| Category | CMP[3] | — |
| Wafer size | up to 12 in wafers[3] | Single Wafer SiC Substrate[5] |
| Carrier type | insert/lapping carrier[3] | — |
| Machine type | double-sided planetary lapping and polishing machines[3] | — |
| Compatible machine examples | 9B / S-F / Lapmaster LSP-9 / etc.[3] | — |
| Configuration | — | Multi Process[4] |
| Voltage | — | 208 V, 3 Phase, 60 Hz[5] |
| Full Load | — | 60 A[5] |
| Motor | — | 36 A[5] |
| Interrupting Capacity | — | 10,000 A[5] |
| Make | — | Strasbaugh[4] |
| Model | — | 6 DS SP[4] |
| Equipment type | — | CMP (Chemical Mechanical Polisher)[4] |
| Wafer sizes | — | 8 inch[4] |
| Operating voltage | — | 208 V[5] |
| Phase | — | 3 Phase[5] |
| Frequency | — | 60 Hz[5] |
| Full load current | — | 60 A[5] |
| Motor current | — | 36 A[5] |
| Automation | — | Fully automated[5] |
| Material | — | Single Wafer SiC Substrate[5] |
| Wafer carriers | — | 2 x 150 mm wafer carriers; 1 x 150 mm wafer carriers[5] |
| Carrier rebuild kit | — | Acid resistance carrier rebuild kit[5] |
| Temperature control | — | Table temperature control unit (SMC chiller)[5] |
| Loading | — | Two cassette slots for loading[5] |
| Unloading | — | Two cassette slots for unloading[5] |
| Polish mode | — | Single sided polish[5] |
| Polish modules | — | 1 polish module equipped with dedicated hardware[5] |
| Pad conditioning | — | Programmable pad conditioning[5] |
| Spindle | — | Overam spindle with 4 passage rotary union[5] |
| Slurry dosing | — | Slurry perilstatic pump dosing on the table[5] |
| Vacuum | — | Universal vacuum pump[5] |