Waferpedia

Comparison ledger

150 e MaskversusAP300

SUSS MicroTec 150 e Mask, Ultratech AP300, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
150 e MaskSUSS MicroTec
AP300Ultratech
OEMSUSS MicroTecUltratech
CategoryLithographyLithography
Wafer size——
Process node——
Introduced—2004
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySUSS MicroTec 150 e MaskUltratech AP300
Specifications
Type—lithography system[1]
Application—advanced packaging[1]
Platform—Unity Platform[1]
Introduction—mid-2004[1]
Category—Photolithography, Semiconductor Fabrication, Steppers[2]
Wafer size—300mm[2]
Vintage—2009[2]
AP line use—Advanced packaging[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]en.wikipedia.orgen.wikipedia.org
  2. [2]csisemi.comcsisemi.com