Waferpedia

Comparison ledger

1000 FamilyversusAP300

Ultratech 1000 Family, Ultratech AP300, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
1000 FamilyUltratech
AP300Ultratech
OEMUltratechUltratech
CategoryLithographyLithography
Wafer size——
Process node——
Introduced—2004
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyUltratech 1000 FamilyUltratech AP300
Specifications
Tool typePhotolithography step-and-repeat 1X stepper[1]—
Optical designWynne Dyson[1]—
Magnification1X[1]—
Tool classPhotolithography step-and-repeat 1X steppers[1]—
Type—lithography system[1]
Application—advanced packaging[1]
Platform—Unity Platform[1]
Introduction—mid-2004[1]
Category—Photolithography, Semiconductor Fabrication, Steppers[2]
Wafer size—300mm[2]
Vintage—2009[2]
AP line use—Advanced packaging[1]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]en.wikipedia.orgen.wikipedia.org
  2. [2]csisemi.comcsisemi.com