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-407B-1-S-CES293 Robotversus199

ABM -407B-1-S-CES293 Robot, YES 199, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
199YES
OEMABMYES
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FamilyABM -407B-1-S-CES293 RobotYES 199
Specifications
ModelABM-407B-1-S-CES293[1]—
DescriptionROBOT[1]—
Refurbished RTP RTAAG Associates 4100, 4108, 8108, 8800, 8800i,210, 310, 410, 610, 610I, MPT RTP-600S, 800S, RTP-3000[1]—
KLA-Tencor Spare Parts and ServiceRS-35C,RS-55,RS-75,RS-100,UV-1050,UV-1080,UV-1250,UV-1280,ASET F5 / F5X,AIT Systems,HRP-220 Stylus Profiler[1]—
Refurbished Isotropic Plasma EtcherMatrix, Tegal, Lam Research, Branson/IPC, PlasmaTherm[1]—
Refurbished PECVD, ALD EquipmentCambridge, Oxford PlasmaLab , Plasma-Therm, STS/SPTS, AMAT[1]—
Refurbished Mask AlignerCanon Neutronix PLA501/545, Suss MA200CC, MA8BA8 GEN3, MA8BA8 GEN2, MA8BA8, MA200E[1]—
Refurbished BondingSUSS SB6E, SUSS SB8E, EVG 620 BA, EVG EV501, West Bond 7200AR 7400A[1]—
Refurbished Wafer ProberElectroglas EG 4090u+, EG 4090, EG 2001X, EG 1034X, Cascade PS-21[1]—
Document topic—Processing procedures for BCB adhesion[2]
Material family—Cyclotene Advanced Electronic Resins / benzocyclobutene (BCB)[2]
Adhesion promoters discussed—AP3000 and AP8000[2]
Recommended adhesion promoters—AP3000 and AP8000 are the only adhesion promoters recommended for use with BCB[2]
Recommended pre-clean—O2 plasma, with or without water rinse[2]
Preferred plasma tool type—RIE-type plasma tools[2]
Adhesion test methods—Tape peel, modified edge lift-off (m-ELT), and bump shear[2]
Tape peel standard—ASTM D-3359-93[2]
Pressure cooker test conditions—121°C, 2 atmospheres pressure, 100% relative humidity[2]
Thickness example—BCB bump shear squares are typically 100 μm x 100 μm[2]
Sources (2)Every fact above is drawn from these public sources
  1. [1]dealer listingsemistarcorp.com
  2. [2]wiki.nanotech.ucsb.eduwiki.nanotech.ucsb.edu