YES

199

Research Quality: 30% complete

The 199 is a technical application note about Cyclotene BCB adhesion processing. The 199 discusses adhesion promoter use, substrate pre-clean, and adhesion test methods. The 199 reports adhesion behavior for BCB on metals, inorganic materials, and polymers.^[1]

YES199

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What is it?

The 199 is represented in the provided source set only by a technical application note on BCB adhesion. The document covers adhesion promoter chemistry, substrate pre-clean methods, processing chemicals, adhesion test methods, and adhesion results for BCB on metals, inorganic materials, and polymers.

What can it run?

Process applications and technology nodes documented for this tool.

BCB adhesion to aluminum, copper, titanium, gold, silicon nitride, silicon oxide, III-V semiconductors, polyimide, and molding compounds
Adhesion promoter application for BCB coating
Substrate pre-clean for BCB processing
Adhesion evaluation using tape peel, m-ELT, and bump shear

Why won't it start?

Documented failure modes, common issues, and field considerations.

BCB adhesion to gold is poor.
BCB adhesion to III-V semiconductors is marginal.
BCB adhesion can degrade when an oxidizing plasma leaves a thin SiO2 layer on BCB.
BCB can delaminate from interfaces exposed to certain etch chemicals such as HF in some cases.
AP8000 is not effective as an adhesion promoter for BCB on aluminum.

What do the numbers mean?

Vacuum & pumping1

Pressure cooker test conditions: 121°C, 2 atmospheres pressure, 100% relative humidity^[1]

Configuration & options9

Document topic: Processing procedures for BCB adhesion^[1]
Material family: Cyclotene Advanced Electronic Resins / benzocyclobutene (BCB)^[1]
Adhesion promoters discussed: AP3000 and AP8000^[1]
Recommended adhesion promoters: AP3000 and AP8000 are the only adhesion promoters recommended for use with BCB^[1]
Recommended pre-clean: O2 plasma, with or without water rinse^[1]
Preferred plasma tool type: RIE-type plasma tools^[1]
Adhesion test methods: Tape peel, modified edge lift-off (m-ELT), and bump shear^[1]
Tape peel standard: ASTM D-3359-93^[1]
Thickness example: BCB bump shear squares are typically 100 μm x 100 μm^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Pressure cooker test conditions121°C, 2 atmospheres pressure, 100% relative humidity^[1]

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Not publicly documented

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Not publicly documented

The following facts about the 199 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 199 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 199 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 199 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 199 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 199 are on record.
Answerable by: an OEM parts catalog or a service engineer