Comparison ledger
Accretech , Tokyo Semitsu Kogaku (TSK) UF200, Hitachi CG 4100, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | , Tokyo Semitsu Kogaku (TSK) UF200Accretech | CG 4100Hitachi |
|---|---|---|
| OEM | Accretech | Hitachi |
| Category | — | — |
| Wafer size | Wafer Equipment | Wafer Equipment |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech , Tokyo Semitsu Kogaku (TSK) UF200 | Hitachi CG 4100 |
| Specifications | ||
| Wafer size | Wafer Equipment[1] | Wafer Equipment[2] |
| Date of Manufacture | 1998[1] | 2013-01-01[2] |
| Currently Configured for | 200mm[1] | 300mm[2] |
| Current Equipment Status | Available[1] | — |
| Available date | Currently Available[1] | — |
| Equipment category | Production Wafer Prober[1] | — |
| Missing or Damaged parts | — | Fab confirmed there were no missing or damaged parts.[2] |
| Vendor | — | HITACHI[2] |
| VID | — | VID761[2] |
| SW Version | — | 35.47[2] |
| Resolution | — | 1.8nm[2] |
| throughput | — | 42wafer/h[2] |
| MAM Time | — | 2.8sec[2] |
| Stage Landing Accuracy | — | ±1μm[2] |