Comparison ledger
Accretech , Tokyo Semitsu Kogaku (TSK) UF3000, Tokyo Electron Act 12, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | , Tokyo Semitsu Kogaku (TSK) UF3000Accretech | Act 12Tokyo Electron |
|---|---|---|
| OEM | Accretech | Tokyo Electron |
| Category | — | — |
| Wafer size | Wafer Equipment | Single-pincette shared wafer transfer with centering guides |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Accretech , Tokyo Semitsu Kogaku (TSK) UF3000 | Tokyo Electron Act 12 |
| Specifications | ||
| Wafer size | Wafer Equipment[1] | Single-pincette shared wafer transfer with centering guides |
| Currently Configured for | 300mm[1] | — |
| With Chiller | SCU-600B[1] | — |
| Section 1 | Tool General Information[1] | — |
| Section 2 | Tool Specific Information[1] | — |
| Manufacturer | Accretech, Tokyo Semitsu Kogaku (TSK)[1] | — |
| Model | UF3000[1] | — |
| Category | Wafer Equipment[1] | — |
| Equipment type | Wafer Prober[1] | — |
| Tool status | In production[1] | — |
| Tool location | Cleanroom[1] | — |
| Chiller | SCU-600B[1] | — |
| Vendor tool serial number | F24006MZ[1] | — |
| Micron MISTI/LID number | FE3SKAA300(TMM)[1] | — |
| Year | 2004[2] | — |
| Quantity | 9[3] | — |
| Short description | Fully Automated Prober[3] | — |
| Version | 300 mm[3] | — |
| Nickel chuck | 12 inch[3] | — |
| Front loading | 300 mm single FOUP loading[3] | — |
| Robot blade | Dual ceramic robot blade[3] | — |
| Software version | S5.0FC4[3] | — |
| Loader type | TSK[3] | — |
| Chuck temperature range | 30~150℃[3] | — |
| OCR camera type | Type6[3] | — |
| Auto card change | Yes[3] | — |
| Needle cleaning unit | 150 mm x 150 mm ceramics pad[3] | — |
| Manipulator | Hinge, MHF4000[3] | — |
| Test system interface | AL6050 & Focus3000[3] | — |
| Includes | Printer[3] | — |
| Configuration | — | 2Coater 2B.L.Cot 4Developer[4] |
| Wafer Size | — | 8 inch[8] |
| Vintage | — | 2003 |
| Coaters & Developers Vintage | — | 2002 |
| Number of Coater Modules | — | 2[4] |
| Number of Bottom-Layer Coat Modules | — | 2[4] |
| Number of Developer Modules | — | 4[4] |
| Direction | — | LEFT HAND SIDE |
| 3 Blocks Interfaced | — | Foup-Process Block-Scanner Interface |
| 3 Wafer Transfer Robot Arms | — | Foup-Process Block-Scanner Interface |
| ➢ Note | — | Exclude HDD OEM Model Description |