Waferpedia

Comparison ledger

UF 3000 EXversus2001 CX

Accretech UF 3000 EX, Electroglas 2001 CX, side by side. Every value shown is drawn from the cited encyclopedia entries.

Documented as functional equivalents— Same function class: Test & Probe, null[1]
Side-by-side comparison of selected equipment models
Attribute
UF 3000 EXAccretech
2001 CXElectroglas
OEMAccretechElectroglas
CategoryTest & ProbeTest & Probe
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyAccretech UF 3000Electroglas EG 2001
Specifications
ConfigurationAuto-tilt Option[2]Single channel[5]
HFMHF 9000 EX[2]—
Aard HolderNobinite[2]—
Card ExchangeAPC[2]—
Temp50℃~150℃[2]—
Cleaning Unit250 x 155 (notched)[2]—
Tester I/FGPIB[2]—
CPUAdvme 7509[2]—
Wafer Size12 inch[4]6 inch[5]
Auto-tilt OptionIncluded[2]—
Tri-TempIncluded[2]—
Chuck Temperature Range50℃~150℃[2]—
Compatible Tester ModelsIP 750 EX-HD[2]—
Card Holder MaterialNobinite[2]—
Tester InterfaceGPIB[2]—
Prober TypeProber[2]—
Wafer Sizes12 inch[4]—
Auto-tilt optionYes[2]—
No ChillerYes[2]—
Vintage2007[2]—
Make—Electroglas[5]
Model—2001 CX[5]
Category—Prober[5]
Channel Configuration—Single channel[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]sec.govsec.gov
  2. [2]inventory listing
  3. [3]inventory listing
  4. [4]Equipment inventory listing
  5. [5]inventory listing