Waferpedia

Electroglas

2001 CX

Test & ProbeElectroglas EG 2001 family
Research Quality: 50% complete
Email

Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

The Electroglas 2001 CX is a wafer prober for 6-inch wafers.[1][2]

2001 CX — Inventory photo
Fig. 012001 CXInventory photo[1]

What it is

The Electroglas 2001 CX is an automatic wafer prober used for test and probe work on semiconductor wafers. The Electroglas business developed automatic wafer probing equipment for semiconductor device fabrication, and its wafer probers position individual devices still in wafer form under contact test probes for electrical testing.[3]

How it works

A wafer prober moves each die on a wafer so that its contact pads align with probe pins on a probe card. The probe card connects to a test system that performs electrical measurements on the device under test.[3]

Wafer probers are used for parametric testing and functional testing at the wafer stage. Parametric testing checks electrical parameters during fabrication or after fabrication, and functional testing identifies devices that do not meet electrical specifications.[3]

Where it fits in the process flow

Wafer probers are used during wafer sort before separation and packaging of individual devices. Wafer probers are also used during in-line testing and end-of-line testing in the fabrication flow.[3]

Applications

The Electroglas 2001 CX belongs to the automatic wafer probing category used for semiconductor device testing. The equipment class is used for wafer sort, in-line testing, end-of-line testing, research and development, and quality and process control applications.[3]

The Electroglas 2001 CX Prober is a legacy test-and-probe tool associated with 6 inch wafer handling.[1]

What do the numbers mean?

Wafer handling3

Wafer Size
6 inch[1]
Accurate?
Equipment Type
Automatic wafer prober[1]
Accurate?
Maximum Wafer Size
6 inch[2]
Accurate?

Performance1

Vision System
Advanced vision processing for automatic alignment[3]
Accurate?

Configuration & options7

Single channel[1]
Accurate?
Make
Electroglas[1]
Accurate?
Model
2001 CX[1]
Accurate?
Category
Prober[1]
Accurate?
Channel Configuration
Single channel[1]
Accurate?
X-Y Stage Positioning
Linear motor on air bearing[3]
Accurate?
Vertical Motion Bearing Options
Sleeve bearing, air bearing, or ball bearing[3]
Accurate?
Interested in this tool?
Need help with this tool?Embed spec card

What replaced it?

Alternatives

Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

What is the primary function of a wafer prober?General reference — not yet source-verified

The primary function is to precisely align and make temporary electrical contact between test equipment and individual semiconductor die on a wafer, allowing each die to be tested before the wafer is diced.

What types of probe cards are commonly used?General reference — not yet source-verified

Common types include cantilever needles, vertical probes, and membrane probes, chosen based on pad pitch, frequency requirements, and number of contact points.

What maintenance is typical for a wafer prober?General reference — not yet source-verified

Routine maintenance includes cleaning the chuck and probe card contacts, verifying alignment accuracy, inspecting probe needles for wear or contamination, and calibrating temperature systems if used.

What role does a wafer prober play in semiconductor manufacturing yield improvement?General reference — not yet source-verified

By testing dice at the wafer level, the prober helps identify defective devices early, allowing process engineers to diagnose yield issues and improve manufacturing processes before further value is added.

Not publicly documented

The following facts about the 2001 CX are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2001 CX are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 2001 CX are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 2001 CX are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 2001 CX are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 2001 CX is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Equipment inventory listing
  3. [3]sec.gov — sec.gov (Mar 26, 1997)sec.gov
Was this page accurate?

Last updated Oct 13, 2026.

Compare with similar tools

View all →