Electroglas
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The Electroglas 2001 CX is an automatic wafer prober used for test and probe work on semiconductor wafers. The Electroglas business developed automatic wafer probing equipment for semiconductor device fabrication, and its wafer probers position individual devices still in wafer form under contact test probes for electrical testing.[3]
A wafer prober moves each die on a wafer so that its contact pads align with probe pins on a probe card. The probe card connects to a test system that performs electrical measurements on the device under test.[3]
Wafer probers are used for parametric testing and functional testing at the wafer stage. Parametric testing checks electrical parameters during fabrication or after fabrication, and functional testing identifies devices that do not meet electrical specifications.[3]
Wafer probers are used during wafer sort before separation and packaging of individual devices. Wafer probers are also used during in-line testing and end-of-line testing in the fabrication flow.[3]
The Electroglas 2001 CX belongs to the automatic wafer probing category used for semiconductor device testing. The equipment class is used for wafer sort, in-line testing, end-of-line testing, research and development, and quality and process control applications.[3]
The Electroglas 2001 CX Prober is a legacy test-and-probe tool associated with 6 inch wafer handling.[1]
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
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The primary function is to precisely align and make temporary electrical contact between test equipment and individual semiconductor die on a wafer, allowing each die to be tested before the wafer is diced.
Common types include cantilever needles, vertical probes, and membrane probes, chosen based on pad pitch, frequency requirements, and number of contact points.
Routine maintenance includes cleaning the chuck and probe card contacts, verifying alignment accuracy, inspecting probe needles for wear or contamination, and calibrating temperature systems if used.
By testing dice at the wafer level, the prober helps identify defective devices early, allowing process engineers to diagnose yield issues and improve manufacturing processes before further value is added.
The following facts about the 2001 CX are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2001 CX are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2001 CX are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2001 CX are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2001 CX are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2001 CX is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Last updated Oct 13, 2026.
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